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***--尹周平（华中科技大学）
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尹周平教授个人简介 姓名：尹周平 电话：027-87559654 职称：教授 邮箱：yinzhp@mail.hust.edu.cn 一、个人基本情况 尹周平，男，1972年9月出生。现任华中科技大学机械科学与工程学院副院长、教授、博士生导师，教育部***特聘教授，国家***基金获得者，数字制造装备与技术国家重点实验室副主任。2000年在华中科技大学获工学博士学位，博士论文获2003年全国优秀博士论文奖；2002年博后出站担任副教授；2004年破格晋升教授；2005年被聘为博士生导师、校特聘教授；2006年获国家***基金资助；2009年受聘教育部***特聘教授；2013年入选科技部中青年科技创新领军人才；2014年获何梁何利青年创新奖。 兼任湖北省人工智能学会常务理事、秘书长，中国人工智能学会智能机器人专业委员会委员、智能制造专业委员会委员，中国机械工程学会高级会员，ASME/IEEE会员，国家自然科学基金机械学科评审专家，973/863计划同行评议专家等；《Frontiers of Mechanical Engineering》编委、《振动、测试与诊断》编委、《IEEE Trans. On Mechatronics》Guest Editor, 《IEEE Trans. On Robotics &Automation》、《Computer-aided Design》、《中国科学》、《机械工程学报》等期刊审稿人。 主持承担了国家自然科学基金重大/重点、973、863等国家级项目，在电子制造技术与装备、复杂产品数字建模与精密测量、RFID技术与应用等方面取得一系列创新性成果。已在"Computer-aided Design"、"ASME Transactions"、"IEEE Transactions"、《中国科学》等国内外权威期刊上发表一批高水平论文，SCI/EI收录100篇次，SCI引用300余次，出版专著3本，授权国家发明专利20余项。获国家技术发明二等奖、国家自然科学二等奖、国家科技进步二等奖各1项，获省部级奖励5项，荣获"中国青年科技奖"、"全国优秀博士后"、"教育部新世纪优秀人才"、"中国机械工程学会青年科技成就奖"等学术荣誉。 二、主要研究方向 电子制造技术与装备 数字化智能化制造技术 三、开设课程 本科生《机器人技术基础》、《柔性电子制造技术基础》 研究生《机器人学》、《先进制造工程学》 四、近年的科研项目、专著与论文、专利、获奖主持了多项国家级重大项目，包括： 1、2010年，国家自然科学基金重点项目"柔性电子跨尺度喷印制造中的动力学行为与调控"，项目负责人。 2、2008年，国家重大基础研究计划（973）课题"高密度倒装键合中多物理量协同控制机制与实现"，项目负责人。 3、2005年，国家863计划重大项目课题"RFID标签封装设备开发与生产"，项目负责人。 五、获得的国家级奖励： 2013年，"高性能无线射频识别(RFID)标签制造核心装备"获国家技术发明二等奖（第一完成人） 2012年，"复杂曲面零件数字化制造的几何推理理论和方法"获国家自然科学二等奖（第三完成人） 2004年，"发动机类零件的快速测量、数字建模及面向制造的设计"获国家科技进步二等奖（第二完成人） 六、荣誉与奖励： 2014年获"何梁何利青年创新奖" 2013年入选科技部"中青年科技创新领军人才" 2009年受聘"教育部***特聘教授" 2007年获"中国青年科技奖" 2006年获"国家***基金" 2005年获"全国优秀博士后" 2004年获"教育部新世纪优秀人才" 2003年获"全国优秀博士论文奖" 七、专利（授权国家发明专利20余项，以下仅部分）： 1、一种气动直线驱动的芯片拾取与翻转装置发明专利ZL201110045760.0 2、一种采用凸轮传动的小行程精密模切装置发明专利ZL201110415903.2 3、一种多带同步输送装置发明专利ZL201010131560.2 4、一种可调压力摩擦输送对辊装置发明专利ZL200910273410.2 5、一种自对心双支撑卡盘发明专利ZL200910273409.X 6、一种芯片拾放控制方法及装置发明专利ZL200910272685.4 7、一种热压头及由其组成的热压装置发明专利ZL200910272540.4 8、一种卷到卷间歇式柔性基材传输的张力控制方法及装置发明专利ZL200810048371.1 9、一种多路高精度温度控制器发明专利ZL200710053106.8 10、一种四自由度倒装键合头发明专利ZL200410061154.8 八、代表性著作： [1] Y. Q. Zeng, B. Tao, and Z. P. Yin*,"Molecular orientation transformation of pentacene on amorphous SiO2: A computational study on the initial growth stage of physical vapor deposition,"Journal of Crystal Growth, vol. 405, pp. 73-80, Nov, 2014. [2] Z. X. Liu, Y. A. Huang, Z. P. Yin*, S. Bennati, and P. S. Valvo,"A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints,"International Journal of Adhesion and Adhesives, vol. 54, pp. 112-123, Oct, 2014. [3] Z. X. Liu, Y. A. Huang, H. M. Liu, J. K. Chen, and Z. P. Yin*,"Reliable Peeling of Ultrathin Die With Multineedle Ejector,"Ieee Transactions on Components Packaging and Manufacturing Technology, vol. 4, no. 9, pp. 1545-1554, Sep, 2014. [4] Y. A. Huang, Y. Z. Wang, L. Xiao, H. M. Liu, W. T. Dong, and Z. P. Yin*,"Microfluidic serpentine antennas with designed mechanical tunability,"Lab on a Chip, vol. 14, no. 21, pp. 4205-4212, 2014. [5] Y. A. Huang, Y. Q. Duan, Y. J. Ding, N. B. Bu, Y. Q. Pan, N. S. Lu, and Z. P. Yin*,"Versatile, kinetically controlled, high precision electrohydrodynamic writing of micro/nanofibers,"Scientific Reports, vol. 4, Aug, 2014. [6] Y. Q. Duan, Y. A. Huang, Z. P. Yin*, N. B. Bu, and W. T. Dong,"Non-wrinkled, highly stretchable piezoelectric devices by electrohydrodynamic direct-writing,"Nanoscale, vol. 6, no. 6, pp. 3289-3295, 2014.[7] N. B. Bu, Y. A. Huang, Y. Q. Duan, and Z. P. Yin*,"Process Optimization of Mechano-Electrospinning by Response Surface Methodology,"Journal of Nanoscience and Nanotechnology, vol. 14, no. 5, pp. 3464-3472, May, 2014. [8] G. H. Wu, B. Tao, and Z. P. Yin*,"Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions,"Microelectronics Reliability, vol. 53, no. 12, pp. 2030-2035, Dec, 2013. [9] Y. Q. Pan, Y. A. Huang, N. B. Bu, and Z. P. Yin*,"Fabrication of Si-nozzles for parallel mechano-electrospinning direct writing,"Journal of Physics D-Applied Physics, vol. 46, no. 25, Jun, 2013. [10] Z. X. Liu, P. S. Valvo, Y. A. Huang, and Z. P. Yin*,"Cohesive failure analysis of an array of IC chips bonded to a stretched substrate,"International Journal of Solids and Structures, vol. 50, no. 22-23, pp. 3528-3538, Oct, 2013. [11] Y. Q. Duan, Y. A. Huang, and Z. P. Yin*,"Transfer printing and patterning of stretchable electrospun film,"Thin Solid Films, vol. 544, pp. 152-156, Oct, 2013. [12] N. B. Bu, Y. A. Huang, and Z. P. Yin*,"The Effect of Substrate on Continuous Electrohydrodynamic Printing,"Advances in Applied Materials and Electronics Engineering Ii, Advanced Materials Research B. Gan, Y. Gan and Y. Yu, eds., pp. 352-356, Stafa-Zurich: Trans Tech Publications Ltd, 2013. [13] S. S. Zeng, X. J. Wan, W. L. Li, Z. P. Yin*, and Y. L. Xiong,"A novel approach to fixture design on suppressing machining vibration of flexible workpiece,"International Journal of Machine Tools &Manufacture, vol. 58, pp. 29-43, Jul, 2012. [14] B. Xiong, and Z. P. Yin*,"A Universal Denoising Framework With a New Impulse Detector and Nonlocal Means,"Ieee Transactions on Image Processing, vol. 21, no. 4, pp. 1663-1675, Apr, 2012. [15] N. B. Bu, Y. A. Huang, H. X. Deng, and Z. P. Yin*,"Tunable bead-on-string microstructures fabricated by mechano-electrospinning,"Journal of Physics D-Applied Physics, vol. 45, no. 40, Oct, 2012. [16] [16] Z. P. Yin*, K. Mo, and Y. L. Xiong,"Defective point data reconstruction based on improved process of morphological operations,"Science China-Technological Sciences, vol. 54, no. 12, pp. 3166-3179, Dec, 2011. [17] B. Peng, Y. A. Huang, Z. P. Yin*, and Y. L. Xiong,"Analysis of interfacial peeling in IC chip pick-up process,"Journal of Applied Physics, vol. 110, no. 7, Oct, 2011. [18] Z. P. Yin*, Y. A. Huang, N. B. Bu, X. M. Wang, and Y. L. Xiong,"Inkjet printing for flexible electronics: Materials, processes and equipments,"Chinese Science Bulletin, vol. 55, no. 30, pp. 3383-3407, Oct, 2010. [19] J. B. Wu, Z. P. Yin*, and Y. L. Xiong,"The fast multilevel fuzzy edge detection of blurry images,"Ieee Signal Processing Letters, vol. 14, no. 5, pp. 344-347, May, 2007. [20] Z. P. Yin, H. Ding, H. X. Li, and Y. L. Xiong,"Geometric mouldability analysis by geometric reasoning and fuzzy decision making,"Computer-Aided Design, vol. 36, no. 1, pp. 37-50, Jan, 2004. [21] Z. P. Yin, H. Ding, H. X. Li, and Y. L. Xiong,"A connector-based hierarchical approach to assembly sequence planning for mechanical assemblies,"Computer-Aided Design, vol. 35, no. 1, pp. 37-56, Jan, 2003. [22] Z. P. Yin, H. Ding, and Y. L. Xiong,"Accessibility analysis in manufacturing processes using visibility cones,"Science in China Series E-Technological Sciences, vol. 45, no. 1, pp. 47-57, Feb, 2002. [23] Z. P. Yin, H. Ding, and Y. L. Xiong,"Virtual prototyping of mold design: geometric mouldability analysis for near-net-shape manufactured parts by feature recognition and geometric reasoning,"Computer-Aided Design, vol. 33, no. 2, pp. 137-154, Feb, 2001. [24] Z. P. Yin, H. Ding, and Y. L. Xiong,"Mouldability analysis for near-net-shaped manufactured parts using freedom cones,"International Journal of Advanced Manufacturing Technology, vol. 16, no. 3, pp. 169-175, 2000. [25] Z. P. Yin, H. Ding, and Y. L. Xiong,"Visibility theory and algorithms with application to manufacturing processes,"International Journal of Production Research, vol. 38, no. 13, pp. 2891-2909, Sep, 2000. [26]《机器人操作》出版于湖北科学技术出版社，2002第二作者 |
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